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2024 VLSI TSA to Kick Off in April
ITRI will host the 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) from April 22 to 25, 2024 at the Ambassador Hotel Hsinchu, Taiwan. Experts from leading companies and prestigious academic institutions, including IBM, MediaTek, Sony, Intel, CEA-Leti, Stanford University, and Yale University, will share their insights and latest research findings on hot issues such as 2nm technology, energy-efficient computing, power devices and electronics, novel quantum computing devices and materials, emerging technologies for high-performance computing, and energy-efficient CMOS materials.
The symposium is a four-day event, consisting of three half-day tutorial sessions and three days of technical presentations of contributed papers, as well as plenary sessions and special sessions on topics including energy-efficient computing, power devices and electronics, novel quantum computing devices and materials, process technology on nanosheet and GAA devices, and emerging high-performance computing technologies.
The technical presentation will start with joint plenary sessions presented by distinguished keynotes: Huming Bu, VP at IBM, will deliver the keynote speech on 2nm technology; Thomas Mikolajick, Scientific Director at NaMLab gGmbH of TU Dresden, will share his insights on ferroelectrics for enhanced semiconductor devices; Yasunori Tanaka, Director of Advanced Power Electronics Research Center of AIST will talk about power devices for automotive vehicles; Yoshihisa Kagawa, General Manager at SONY, will present 3D stacking process technologies for advanced CMOS image sensors; and Yosuke Aragane, VP of NTT, will deliver a speech on how innovative optical and wireless network (IOWN) will enable next-generation sustainable ICT infrastructure.
The VLSI TSA will take place in Hsinchu, Taiwan on April 22 to 25, 2024.
Following these sessions, experts from industry and academia worldwide will discuss the latest technologies related to energy-efficient computing during the joint special sessions. Dr. Leon Heng-Liang Huang from MediaTek will illustrate what people can trade for energy-efficient foundation IP in the FinFET process. Professor Hajime Tanaka of Osaka University will share his findings on the modeling and simulation of carrier transport in 4H-SiC. Professor Priya Panda of Yale University and Dr. Kuo-Ken Huang of Everactive Inc. will unveil the secrets of neuromorphic computing for energy-efficient edge intelligence and ultra-low-power receivers in self-powered industrial IoT applications.
The 2024 VLSI TSA incorporates an in-person symposium and on-demand video presentations after the physical event. Following the physical event, the symposium will provide on-demand video presentations for registered attendees for one month.